ANN ARBOR, MI
Small mobility vehicles, such as electric scooters, are essential to the shift towards electrified transportation. However, their limited driving range and lack of onboard charging capabilities remain significant challenges. Addressing this, Dr. Feng Zhou and his collaborators from the University of Michigan-Dearborn, have introduced an innovative bare-die embedding PCB packaging technology, recently published in IEEE Transactions on Components, Packaging and Manufacturing Technology.
The research showcases a compact and high-power-density design for power electronics units, achieved by embedding the bare die of switching devices into PCB layers. Using multilayer routing and cooling strategies, the new technology significantly enhances system efficiency. The electrothermal design reduces parasitic loop inductance by 74%, increases power density by 113%, and extends the driving range of small mobility vehicles by 16.6% compared to traditional approaches.
The team also developed a new thermal model to optimize the system’s performance further. This model was validated alongside a high power-density power electronics unit that integrates motor drive and onboard charging. Benchmark comparisons confirmed the effectiveness of the proposed bare-die embedding technology, marking a significant step forward in electrified transportation.
For detailed information, please refer to the published paper in IEEE Transactions on Components, Packaging and Manufacturing Technology.
