ANN ARBOR, MI
High-performance electronics require innovative solutions to manage ever-increasing heat fluxes. Dr. Ercan M. Dede’s latest collaborative research with UC Merced, Stanford University, and NREL, published in Applied Thermal Engineering, introduces a novel cooling technique utilizing a metallic mesh manifold to enhance phase-change cooling efficiency.
The study explores the use of a copper mesh manifold to optimize liquid and vapor flow above a pool-fed heat transfer surface under boiling conditions. This structure directs cooling fluid evenly over the heated surface using capillary action while allowing efficient vapor escape through open channels. The innovative design minimizes resistance to liquid flow and maximizes the effective heated area, addressing critical challenges in high-heat-flux electronics cooling applications.
Experimental results demonstrate the potential of this method. When applied to a laser-textured aluminum nitride heat dissipation surface with specialized pin-fin structures, the manifold achieved a maximum heat flux of 490 W/cm², which is 65% higher than the performance of the porous pin-fin surface under boiling conditions alone. Furthermore, the system maintained stable operation with a superheat limit 14 °C higher than configurations without the manifold.
For detailed information, please refer to the published paper in Applied Thermal Engineering.