ANN ARBOR, MI
Dr. Ercan M. Dede and his team at TRINA have published research in the Journal of Electronic Packaging that explores the role of additive manufacturing in revolutionizing thermal solutions for heterogeneous integration of electronics. Their work, in collaboration with Stanford University and various other research groups, delves into the critical importance of thermal management to support advancements in energy conversion systems, computing architectures, and more.
The review highlights how three-dimensional printing methods and materials, such as metals, polymers, ceramics, and composites, are unlocking new possibilities for cold plates, heat sinks, and other thermal management components. Beyond materials, the publication examines conceptual workflows for electronics package integration and design optimization tailored for additive manufacturing. This includes numerical design optimization methods, new electronics packaging configurations, and how advanced additive manufacturing technologies may be used to realize such packages. This comprehensive prospective demonstrates the immense potential of advanced manufacturing techniques to meet the demands of future electronics applications.
This article is an expanded version of a section contained within the Institute of Electrical and Electronics Engineers (IEEE), Electronics Packaging Society (EPS), Heterogeneous Integration Roadmap (HIR) chapter on Additive Manufacturing & Additive Electronics for Heterogeneous Integration. The HIR activities are sponsored by IEEE in coordination with the Electronics and Photonics Packaging Division (EPPD) of ASME.
For detailed information, please refer to the published paper in Journal of Electronic Packaging.
The reader is also referred to the IEEE HIR website: Heterogeneous Integration Roadmap – IEEE Electronics Packaging Society.
Fig.: A topology optimized and additively manufactured manifold microchannel (MMC) heat sink for electronics cooling.
Ref.
US9353999B2 – Cooling apparatuses and electronics modules having branching microchannels