ANN ARBOR, Mich. Understanding of vapor chamber technology advanced for high performance thermal management of electronics.
TRINA scientists and researchers at Purdue University recently published a joint article titled “Investigation of boiling behaviors in vapor chambers in response to transient heat input profiles” in the journal Applied Thermal Engineering. In this paper, they reported on experimental characterization of the boiling behaviors in vapor chambers under time-varying input powers with an eye towards power electronics cooling. This study illustrates that heat spreading technologies that incorporate vapor chambers for pulsed heat loads should be judiciously designed considering the steady state heat load in addition to the on-power and duty cycle.
